[Discuss] OSHW Best Practices / Layers of Openness
mperry at pensanyc.com
Thu Feb 28 19:46:17 UTC 2013
True, and this is "open hardware" not "open product"
On Thu, Feb 28, 2013 at 2:34 PM, Pierce Nichols <pierce at logos-electro.com>wrote:
> It's clearly possible to have separate files for the 'functional' bits
> of a design and the 'trade dress' portions. For example, the Arduino
> design files are readily available... but the graphics on the board
> (the trade dress) is not readily available.
> On Thu, Feb 28, 2013 at 10:35 AM, Chris Church
> <thisdroneeatspeople at gmail.com> wrote:
> > On Feb 28, 2013, at 11:58 AM, Tom Igoe wrote:
> >> Contrary to Chris' POV, I don't think enclosures are simply protective
> or decorative. The physical interface of a device is part of the
> enclosure: the buttons, the screen if there is one, the speaker, the
> connectors -- all of those are functional elements of a finished product.
> If we want to see more OSHW finished products, that means giving
> mechanical engineers and industrial designers more examples of how to
> functionally open their work. So how do we describe what's open about a
> product with multiple manufacturing steps? It doesn't have to be a layered
> description; anyone want to propose an alternative?
> > Hi Tom,
> > I guess I should clarify where my POV comes from here, and it starts at
> our design: we don't make any of the HMI part of the enclosure. All of our
> inputs, screens, etc. are on PCBs which we open-source, and the enclosure
> really is nothing more than a "plastic protector for the interior
> components." This is largely because we do all of our assembly in-house,
> and its far cheaper to stuff boards than to have people hand-wire buttons,
> > I suppose for those that use primarily panel-mount buttons, etc. that's
> a different story. For the few cases where we've had panel-mount equipment
> (for example a joystick), we put them in the BOM and even provided in-house
> design 3d models of the parts that we used for placing the holes in the
> plastic enclosure. We even include full 3d files of the stuffed boards to
> make it easier for people to make their own enclosures.
> > I have some tangential words to say on the subject based on my
> real-world experience with cloners that have shaped our policy of not
> sharing enclosure machining files, but I think it's better saved for a
> different conversation on a different day. But, I'd be happy to share our
> experiences if anyone wants to know.
> > Chris
> > _______________________________________________
> > discuss mailing list
> > discuss at lists.oshwa.org
> > http://lists.oshwa.org/listinfo/discuss
> Pierce Nichols
> Principal Engineer
> Logos Electromechanical, LLC
> discuss mailing list
> discuss at lists.oshwa.org
marco perry . principal, pensa
20 jay st., suite 800, brooklyn, ny 11201
p 718-855-5354 . blog.pensanyc.com <http://www.pensanyc.com/> .
www.pensanyc.com . @thinkpensa
-------------- next part --------------
An HTML attachment was scrubbed...
More information about the discuss